Laser Thermal collaborates with NIST to boost semiconductor R&D

“Laser Thermal is the first company to commercialise a thermoreflectance instrument based on our patented SSTR-F technology, enabling direct measurements of thermal conductivity and resistance.”

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Laser Thermal has partnered with the National Institute of Standards and Technology (NIST) as the duo works on semiconductor research and development (R&D). The Charlottesville-based company will supply NIST with its thermal conductivity measurement tool, the Steady State Thermoreflectance in Fiber (SSTR-F). Through this partnership, the duo hope to advance the CHIPS for America Metrology Program, which aims to enhance the accuracy and precision of microelectronic materials and devices.

“While thermoreflectance is a powerful measurement technique, these tools are traditionally homemade, requiring dedicated and experienced staff,” said John Gaskins, Co-Founder and CEO of Laser Thermal. “Laser Thermal is the first company to commercialise a thermoreflectance instrument based on our patented SSTR-F technology, enabling direct measurements of thermal conductivity and resistance. We are thrilled to work with NIST and contribute to the advancement of metrology in microelectronics manufacturing.”

Key features of the SSTR-F tool:

  • Provides non-contact, non-destructive optical measurements.
  • Assesses the thermal conductivity of thin films, interfaces, and bulk materials.
  • Supplies the user with insights into the thermal properties of multilayer material structures.
  • Users can validate and improve thermal measurement methods with valuable data and protocols that will help guide future R&D.

The SSTR-F tool assesses the thermal conductivity of thin films, interfaces, and bulk materials and is ideal for applications including wide bandgap power electronics and packaging materials. Building on traditional methods, Laser Thermal’s tool can provide reliable measurements at critical length scales.

What challenges does the CHIPS for America Metrology Initiative aim to solve:

  • Ensuring the integrity and quality of materials used in the semiconductor industry.
  • Developing new measurement techniques.
  • Enhancing measurement methods for packaging technologies.
  • Improve the modelling and simulation of the materials and designs used in semiconductor manufacturing.
  • Refine modelling and simulation processes.
  • Standardise the settings of new materials, processes, and equipment in microelectronics.
  • Support the security and traceability of microelectronic components.